Winding Window Space (Shared Window)
Conductor Specification & Insulation
Electrical & Thermal Parameters
Ratio of total winding build thickness W_build to usable window width W_usable.
AC resistance multiplier due to proximity and skin effect (Dowell).
Actual RMS current density in bare copper cross-section.
Winding Health & Diagnostics
Alternative Conductor Recommendation
On this shared core window, switching to Planar PCB Coil yields a 60% reduction in AC copper loss (7.70 W vs. 19.50 W).
Compare 5 Conductor Technologies on Shared Window
| Conductor Technology | Proposed Spec | R_DC (mΩ) | F_R (×) | R_AC (mΩ) | Loss P_Cu (W) | Cu Fill (Ku) | Build Util (%) | Window Fit | Action |
|---|---|---|---|---|---|---|---|---|---|
Litz Wire Active | 375/0.100 (25 × 3 × 5) | 15.4 | 3.92× | 60.2 | 19.50 W | 27.2% | 83% | ⚠ TIGHT | Active |
Solid / Multifilar Wire | 2filar × ⌀1.37 mm | 13.3 | 29.95× | 398.9 | 129.24 W | 27.2% | 48% | ✓ PASS | |
Flat / Edgewise Wire | 2.97 × 0.99 mm (Edgewise) | 14.2 | 16.72× | 236.6 | 76.65 W | 27.2% | 62% | ✓ PASS | |
Copper Foil | 23.4 mm × 126 µm | 13.7 | 4.94× | 67.5 | 21.87 W | 27.2% | 54% | ✓ PASS | |
Planar PCB Coil | 12-Layer Stackup, 3 oz (28.0 mm trace) | 16.1 | 1.48× | 23.8 | 7.70 W | 27.2% | 95% | ⚠ TIGHT |
Physics & Formulas: High-Frequency Litz Wire
Sullivan-Zhang Strand Optimization (1999)
Determines the optimal single strand diameter balancing DC conduction and proximity AC eddy loss based on skin depth δ(f, T) and layer count m.
Litz Wire Bundle Outer Diameter (OD)
Calculates total bundle diameter including stage twisting packing dilation factor kstage (1.00 - 1.05) and outer serving insulation thickness.
Industrial Cabling Breakdown
Decomposes total strand count into real-world manufacturing cabling stages (primary bundle of 7-60 strands, followed by 3-, 4-, or 5-strand secondary operations).
Modified Dowell Proximity Factor
Maps multi-strand twisted bundles into an equivalent number of conductive foil layers for 1D Dowell high-frequency eddy loss calculation.