PE

Hi, I'm a power electronics engineer.

Unlike generic wire charts that only list AWG tables, this Litz Wire Calculator actively solves the coupled trade-off between strand diameter, proximity loss factor $F_R$, and physical bobbin fit in the transformer window.

You can lock individual parameters (like available strand stock or strand count) to see their immediate impact on copper loss and window utilization.

Conductor Technology:
1

Winding Window Space (Shared Window)

2

Conductor Specification & Insulation

3

Electrical & Thermal Parameters

Proposed Spec 375/0.100 (25 × 3 × 5) Standard SKU: LZ-375-0100-SN
Outer Diameter (OD) 2.72 mm Strand wire: ⌀0.100 mm
AC Loss Factor F_R (AC/DC) 3.92× Skin depth δ: 0.240 mm
Copper Loss P_Cu 19.50 W R_AC = 60.2 mΩ (R_DC = 15.4 mΩ)
Conductor Cross-Section & Current Density Adaptive Cross-Section
Window Build Utilization WARNING
82.7 % (≤ 80% Safe)
0 % Warn: 80 Max: 100

Ratio of total winding build thickness W_build to usable window width W_usable.

AC Proximity Factor (F_R) FAIL
3.9 × (≤ 1.6 Optimal)
1 × Warn: 1.6 Max: 2.5

AC resistance multiplier due to proximity and skin effect (Dowell).

Current Density (J) PASS
6.1 A/mm² (Target: 6 A/mm²)
0 A/mm² Warn: 6.8999999999999995 Max: 8.100000000000001

Actual RMS current density in bare copper cross-section.

🩺

Winding Health & Diagnostics

1 Notice
TIP

Alternative Conductor Recommendation

On this shared core window, switching to Planar PCB Coil yields a 60% reduction in AC copper loss (7.70 W vs. 19.50 W).

Recommendation: Switch to the Planar PCB Coil tab to evaluate detailed winding parameters.
📊

Compare 5 Conductor Technologies on Shared Window

Shared Window Evaluation · Dowell 1D Loss Comparison
Conductor TechnologyProposed SpecR_DC (mΩ)F_R (×)R_AC (mΩ)Loss P_Cu (W)Cu Fill (Ku)Build Util (%)Window FitAction
Litz Wire Active
375/0.100 (25 × 3 × 5)15.43.92×60.219.50 W27.2%83%⚠ TIGHTActive
Solid / Multifilar Wire
2filar × ⌀1.37 mm13.329.95×398.9129.24 W27.2%48%✓ PASS
Flat / Edgewise Wire
2.97 × 0.99 mm (Edgewise)14.216.72×236.676.65 W27.2%62%✓ PASS
Copper Foil
23.4 mm × 126 µm13.74.94×67.521.87 W27.2%54%✓ PASS
Planar PCB Coil
12-Layer Stackup, 3 oz (28.0 mm trace)16.11.48×23.87.70 W27.2%95%⚠ TIGHT

Physics & Formulas: High-Frequency Litz Wire

📐

Sullivan-Zhang Strand Optimization (1999)

dopt = δ(T) · (πη/4)-1/4 · [3/(5m² - 1)]1/4

Determines the optimal single strand diameter balancing DC conduction and proximity AC eddy loss based on skin depth δ(f, T) and layer count m.

🧶

Litz Wire Bundle Outer Diameter (OD)

ODtotal = 1.154·√N·denamel·kstage + ΔDserving

Calculates total bundle diameter including stage twisting packing dilation factor kstage (1.00 - 1.05) and outer serving insulation thickness.

⚡

Industrial Cabling Breakdown

Ntotal = Nprimary × m₁ × m₂ ...

Decomposes total strand count into real-world manufacturing cabling stages (primary bundle of 7-60 strands, followed by 3-, 4-, or 5-strand secondary operations).

📊

Modified Dowell Proximity Factor

meff = mlayers · √(0.65 · Nstrands)

Maps multi-strand twisted bundles into an equivalent number of conductive foil layers for 1D Dowell high-frequency eddy loss calculation.

Related Tools