Parameters
Live Visualization
Analysis Results
Trace Path Builder
Chain multiple trace segments in series to analyze a complete power path. Detects the bottleneck segment — the narrowest section with the highest thermal stress.
How It Works
Current Capacity (IPC-2221B)
Where k = 0.048 (external) / 0.024 (internal), ΔT = temperature rise (°C), A = cross-section area (mil²).
Trace Resistance
Copper resistivity ρ = 1.724×10⁻⁸ Ω·m at 20°C, with temperature correction α = 3.93×10⁻³ /°C.
Thermal Heatmap
HSL color: hue slides from 120° (green, safe) to 0° (red, danger) as current utilization increases.
Reverse Calculation
Inverting the IPC-2221B formula to find the minimum trace width that safely carries a given current.
Related Tools
Feedback & Bug Reports
Help improve this tool
Did you find a miscalculation? Have an idea for a new feature? I actively maintain this project and would love to hear from you. Drop a message and let's make PCB design easier for everyone.